Description
- High Thermal Conductivity – Ensures efficient heat transfer from CPU/GPU to heatsink.
- Easy-to-Use Syringe Design – Precise application with minimal wastage.
- Non-Corrosive & Non-Conductive – Safe for all electronic components.
- Stable Performance – Long-lasting compound that doesn’t dry out quickly.
- Wide Temperature Range – Reliable performance under extreme temperatures.
- Air Gap Filling – Eliminates microscopic gaps for maximum cooling efficiency.
- Ideal for CPU, GPU & Chipsets – Suitable for desktop, laptop, gaming rigs, and servers.
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